Volsun VS-TP1001 is a two-component 1:1 heat-curing silicone heat-conductive potting adhesive, which cures at room temperature or after heating to form elastic heat-conductive silicone rubber. It is specially designed for the manufacture of electronic and electrical products and modules, such as the potting protection of high-power power supply modules, frequency converters, sensors, etc., and the connection and fixation between on-board electronic devices and PCBs.



This product has the following excellent properties:

• Operating temperature: -70℃~+200℃
• Excellent mechanical properties and ductility
• Excellent thermal conductivity and aging resistance
• Low viscosity, self-leveling, excellent seam drilling ability
• Low modulus, low stress, good adhesion to metals and plastics

And you can check the below technical performance data to know more details:

Item	Typical value	Test method
Mixing ratio	1:1	/
Color(After mixing)	Grey	Visual inspection
Viscosity(Component A) @25℃	2500±500cps	ASTM D2196
Viscosity(Component B) @25℃	2500±500cps	ASTM D2196
Viscosity(After mixing) @25℃	2500±500cps	ASTM D2196
Opening hours@25℃	≥60min	/
Curing condition	30min/50℃；20min/100℃	/
Thermal conductivity	1.0±0.2 W/m·k	ASTM D5470
Thermal resistance	0.000815m2·k/W	ASTM D5470
hardness	65±5 Shore A	GB/T 531.1-2008
density	2.0±0.2 g/cm3	GB/T 1033.1-2008
Tensile strength	＞0.5 MPa	GB/T 528-2009
Elongation at break	＞10%	GB/T 528-2009
Flame retardant rating	V-0	UL94
Breakdown strength	≥15 kV/mm	GB/T 1695-2005
Volume resistivity	≥ 1.0×1014 Ω·cm	GB/T 1692-2008
Dielectric constant （1000Hz）	3.9~4.6	GB/T 1693-2007

Here are Dimensions:

Type	Packing
VS-TP1001（1kg）	Component A 0.5kg; Component B 0.5kg
VS-TP1001（20kg）	Component A 10kg; Component B 10kg
VS-TP1001（40kg）	Component A 20kg; Component B 20kg
VS-TP1001（80kg）	Component A 40kg; Component B 40kg
VS-TP1001（100kg）	Component A 50kg; Component B 50kg

Note: Special size and packaging can be customized upon requirements.




 
Instructions

• Stirring A and B components separately
• Mixing the well-stirred components A and B at the ratio of 1:1 (either volume ratio/weight ratio can be used)
• The mixed compound is poured into the device to be filled and cured (room temperature or heating can be cured).

Cautions

• In order to ensure the uniform distribution of fillers, component A and component B must be separately stirred before mixing, so that each compound is evenly mixed
• A and B agents will react and cure each other after mixing, so they need to be used after mixing, and can not be used twice after mixing and curing
• When pouring into the protective part, there should be no large debris or other pollutants in the protective part to avoid affecting the adhesion of materials and objects
• Before the material is fully cured, keep other objects away from the material, which may affect the appearance and protective performance of the material
• Keep this product away from the mouth and eyes. If it enters the mouth and eyes accidentally, rinse it with clean water or go to the hospital
• For high thermal conductivity, vacuum defoaming is required prior to perfusion
• In low temperature environment, the curing time will be extended correspondingly

Storage conditions and shelf life

• Products should be stored in the original packaging, keep the lid closed, avoid contamination (temperature: 15℃ < T < 30℃; Relative humidity: RH < 70%)
• The shelf life is 9months from the production date

 
Welcome to contact us at any time if any questions or needs.

• CONTACT TEL: +86-512-66386808
• SALES CONTACT: volsun2006@szvolsun.com