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VS-GP3001 High Thermal Conductive Silicone Rubber Pads for Electronics Components



Description


Volsun VS-GP3001 Silicone thermal pads achieve low interfacial thermal resistance at relatively low pressures, with excellent thermal conductivity, thermal stability, flexibility and resilience, safe and reliable use. Applied between the power device and the cooling aluminum sheet or the machine shell, the air can be effectively excluded to achieve good thermal conductivity filling effect.



Features
  • Operating temperature: -40℃~+200℃

  • High thermal conductivity, low thermal resistance

  • Excellent surface wettability and resilience

  • Excellent flame retardancy

  • Multiple thickness selection, wide application range

  • Environmental protection standards: RoHS, REACH


Technical Performance

Item Typical value Test method
 color Grey /
Density (g/cm3) 3.0 ASTM D792
Thickness (mm) 0.5~5.0 ASTM D374
Hardness (Shore OO) 30-70 GB/T 531.1-2008
Tensile strength (KPa) ≥100 GB/T 528-2009
Elongation at break (%) ≥25 GB/T 528-2009
Thermal conductivity (W/m·k) 3.0 ASTM D5470
Flame Rating V-0 UL94
Breakdown strength (kV/mm) >6 ASTM D149
Volume resistivity ≥1.0×10 12 Ω·cm ASTM D257
Compressibility(%) >50 GB/T 20671.2-2006
Oil Penetration(%) ≤2 /
 

How to Apply Thermally Conductive Silicone Pads?

  • Clean the surface of the substrate to be installed before use
  • Select products with corresponding specifications based on the dimensions of the installation parts
  • The environment should be free of large debris or other pollutants to avoid affecting the installation effect and protective performance of the materials
  • The specifications of the product should be similar to the dimensions of the installation site. The deviation should not be too large

Storage conditions & shelf life

  • Temperature: 20℃<T<30℃
  • Relative humidity: RH<80%
  • Shelf life: 12 months from the production date



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